AST 3000
Advanced Rapid Thermal Processing for 300 mm and 200 mm Applications
The 3000 is Mattson’s most advanced RTP system for high-volume production of devices down to 100 nm feature size. The 3000’s fast ramp-up capability, along with it’s unparalleled temperature control performance, ultimately allow chipmakers to achieve the ultra-shallow junctions necessary for the production of devices with 0.13μ and below design rules.
Process Applications
- Ultra-Shallow Junction Formation
- Implant Anneal
- Rapid Thermal Oxidation
- Oxynitrides
- Glas Reflow (BPSG, PSG)
- Silicidation (TiSix, CoSix)
Benefits
- High yield enabled by unique dual-side wafer heating and superior uniformity across the wafer
- Minimized pattern effect compared to single-side heating RTP systems
- Advanced processing capabilities for USJ and CoSix formation
- Minimum thermal stress and strain in the wafer
- Excellent process repeatability
- Highest level of flexibility in the production environment
Features
- Dual-side wafer heating
- 56 individually controllable lamps for superior uniformity control during the entire process
- Slip guard ring for compensation of edge effects and elimination of slip lines
- Wafer rotation
- Flash anneal temperature controller
- Contact-less absolute temperature measurement with active compensation for different wafer backsides using in-situ emissivity monitoring
- Optional toxic gas processing capability
- Precise concentration processing capability for tight ambient control
- Dual-arm robot for maximum throughput
- 200/300 mm bridge tool capability
- Distinct configurations for wafer manufacturers are available upon request
3000 Process Chamber
3000 Layout
